Lead Engineering Functions: Oversee product, test, process, and assembly engineering to ensure high-quality and cost-effective production, with a focus on "China for China" localization.
Optimize Engineering Processes: Implement strategies to enhance yield, reduce cycle time, and improve overall production efficiency, tailored to local market needs.
Drive Continuous Improvement: Analyze data to identify and resolve issues, and lead initiatives for process optimization and innovation, ensuring alignment with local requirements.
Ensure Compliance and Standards: Maintain alignment with industry standards and best practices across all engineering activities, while adapting to local regulatory and market conditions.
半导体行业，封装厂的工程工作经验，testing，
The job requires the following qualifications:
☐ according to standard template*
Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, or a related field.
Minimum of 8 years of experience in semiconductor manufacturing, with a strong background in product engineering, test engineering, process engineering, and assembly engineering.
Proven track record of managing and optimizing outsourced production operations.
In-depth knowledge of semiconductor manufacturing processes, including wafer fabrication, assembly, and testing.
Strong analytical and problem-solving skills, with the ability to drive process improvements and resolve complex engineering issues.
Excellent leadership and team management skills, with the ability to mentor and develop a high-performing engineering team.
Strong communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams and external partners.
Familiarity with industry standards and best practices, including ISO 9001, Six Sigma, and Lean Manufacturing principles.
Willingness to travel to external manufacturing sites as needed.
工作经验
5-10年
